UniSCool raises €75K Pre-Seed round
1 July 2023· Lleida, Spain· infrastructure, thermal_management, ai, b2b, deep_hardware
The grant supports the development of smart in-chip liquid cooling for advanced microelectronic systems
Investors
LeadEuropean Union
About UniSCool
Headquarters
Lleida, Spain
Founded
2022
Team Size
6–20
Sectors
infrastructurethermal_managementaib2bdeep_hardware