UniSCool raises €2.5M Seed round
23 February 2026· Lleida, Spain· infrastructure, thermal_management, ai, b2b, deep_hardware
The funding from the EIC Accelerator will be used to industrialize its liquid cooling technology for data centers
Investors
LeadEuropean Innovation Council
About UniSCool
Headquarters
Lleida, Spain
Founded
2022
Team Size
6–20
Sectors
infrastructurethermal_managementaib2bdeep_hardware