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Tempow raises €3.6M Series A round

23 May 2018· Paris, France· consumer_electronics, audio, embedded_software, bluetooth, b2b, pure_software

Tempow plans to use this new round of funding to close new distribution deals with hardware manufacturers and double the size of their global team.

Investors

LeadBalderton Capital

Also participating

C4 Ventures

About Tempow

Stage

Series A

Headquarters

Paris, France

Founded

2016

Team Size

21–50

Sectors

consumer_electronicsaudioembedded_softwarebluetoothb2bpure_software

http://www.tempow.com

Source: https://www.balderton.com/news/tempow-announces-series-a-to-enable-bluetooth-as-a-platform-for-chipmakers-and-device-manufacturers/